Ultrasonic module and method for manufacturing the same
US10657349B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 20, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/70
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.