Electronic apparatus and fingerprint module thereof
US10657355B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint module and an electronic apparatus are described. The fingerprint module may include: an encapsulation layer and a decoration component. The encapsulation layer may be configured to encapsulate a fingerprint identifying assembly and include a rear wall having a first mating portion. The decoration component may define an embedded groove and include a second mating portion in the embedded groove. The encapsulation layer may be embedded in the embedded groove, and the first mating portion may be embedded to the second mating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.