Electronic apparatus and fingerprint module thereof
US10657356B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Nov 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint module may include a fingerprint identifying assembly, a decoration component, a circuit board assembly and a conductive component. A front side of the decoration component may define an embedded groove, the fingerprint identifying assembly may be embedded in the embedded groove, an end of the circuit board assembly may extend into the embedded groove and be attached to a rear end surface of the fingerprint identifying assembly, a ground terminal may be disposed on the circuit board assembly, the conductive component may be sandwiched between the end of the circuit board assembly and a bottom wall in the embedded groove of the decoration component to electrically connect the decoration component to the ground terminal through the circuit board assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.