Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet
US10658200B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin film component sheet includes: a conducting interconnection layer formed of a conductor; an insulating layer that is laminated on the conducting interconnection layer and is formed of an insulating material; and a plurality of thin film electronic components, each of which has a pair of first and second electrode layers and a dielectric layer provided between the first and second electrode layers, and which are arranged to be separated on the insulating layer. In a state in which a main surface of the first electrode layer in each of the plurality of thin film electronic components is exposed to an outside on a main surface of one side of the thin film component sheet, a flat surface of the main surface of the thin film component sheet is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.