Method of forming a composite substrate for layered heaters
US10658206B2 · kind B2 · utility
0Cited by
8References
19Claims
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Key dates
| Filing date | Oct 6, 2015 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Dec 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.