Device with top-side base plate
US10658276B2 · kind B2 · utility
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19Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 16, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.