Semiconductor device and method for manufacturing the same
US10658304B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 28, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an electroconductive shielding layer, an isolation layer formed with a frame-shaped opening, a wiring layer on the isolation layer to be surrounded by the opening, a semiconductor element on the wiring layer with its back surface facing the wiring layer, electroconductive pillars spaced apart from the semiconductor element and standing on the wiring layer, and an electroconductive frame standing on an exposed region of the shielding layer through the opening, with the frame surrounding the semiconductor element and the electroconductive pillars. The semiconductor device further includes an electrically insulating sealing resin that covers the wiring layer and the semiconductor element, and the frame is configured to be electrically connected to an external ground terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.