Interconnect using embedded carbon nanofibers
US10658349B1 · kind B1 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Sep 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to the design of a device capable of increasing the electrical performance of an interconnect feature by amplifying the current carrying capacity of an interconnect feature. The device comprises a first body comprising a first surface with at least one nanoporous conductive structure protruding from the first surface. The device further comprises a second body comprising a second surface with arrays of nanofibers extending from the second surface and penetrating into corresponding nanoporous conductive structures to form conductive pathways between the first body and the second body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.