Carrier release
US10658401B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | May 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.