Ultraviolet light emitting diode and manufacturing method thereof

US10658550B2 · kind B2 · utility

Assignee

• XIAMEN SAN'AN OPTOELECTRONICS CO., LTD. · CN

Inventors

• Junpeng SHI · Xiamen, CN
• Qiuxia Lin · Xiamen, CN
• Zhenduan Lin · Xiamen, CN
• Chen-ke HSU · Xiamen, CN
• Chih-Wei Chao · Baoshan, TW

Key dates

• Filing date: Nov 10, 2018
• Grant date: May 19, 2020
• Expiry date: Nov 10, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.