Ultrasound transducer and manufacturing method thereof
US10658563B2 · kind B2 · utility
1Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/20
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.