Organic light emitting diode encapsulation structure, display apparatus and encapsulation method of organic light emitting diode
US10658613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jun 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
Abstract
An encapsulation method of an organic light emitting diode, an organic light emitting diode encapsulation structure and an organic light emitting diode display apparatus are provided. The encapsulation method includes: providing an encapsulation cover plate and a base substrate with an organic light emitting diode device; forming a first sealant of the encapsulation cover plate, in which the first sealant includes a plurality of protrusion portions spaced apart with each other; forming a second sealant on the encapsulation cover plate, in which the second sealant includes a plurality of protrusion portions and a height of each of the plurality of protrusion portions of the second sealant is greater than a height of each of the plurality of protrusion portions of the first sealant; and bonding the encapsulation cover plate and the base substrate, in which the second sealant covers the organic light emitting diode device and the first sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.