Wireless printed circuit board assembly with integral radio frequency waveguide
US10658739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Mar 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An printed circuit board (PCB) assembly and method of assembling the same for a high-speed, short-reach communication link are described that provide a mechanism for transmitting radio frequency (RF) waves from one digital electronic component of the PCB assembly to another, where the second digital electronic component is located either on the same PCB assembly or on a second PCB assembly. The assembly includes a PCB having multiple layers and a digital electronic component supported by the PCB. At least one of the layers defines a channel that confines RF waves therein. An RF antenna in communication with the digital electronic component extends into the channel, and the RF antenna transmits RF signals generated by the digital electronic component into the channel as RF waves or receives RF waves via the channel and conveys corresponding RF signals to the digital electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.