Method of manufacturing electronic board and mounting sheet
US10660216B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2019 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jan 10, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.