Film production method and system
US10661305B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jul 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The film production method includes: forming an ink layer on the base substrate covering the surface of the base substrate, the ink layer including a solvent and a film-forming material dissolved in the solvent; blowing gas to the ink layer so that the solvent in the ink layer spreads towards the periphery of the base substrate; removing the solvent in the ink layer so that the film-forming material in the ink layer forms a film covering the surface of the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.