High displacement ultrasonic transducer
US10661308B2 · kind B2 · utility
0Cited by
9References
17Claims
0Family size
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Key dates
| Filing date | Nov 20, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jun 19, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0307
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In some examples, a method of fabricating a transducer includes disposing a plurality of anchors on a substrate and disposing a sealing material and a device layer over the anchors and the substrate to form a cavity, the sealing material sealing the cavity. The method may further include forming, in the device layer, a plate and at least one spring member. The at least one spring member may be supported by at least one anchor of the plurality of anchors, and the at least one spring member may support the plate to allow relative movement between the plate and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.