Platen planarizing process for additive manufacturing system
US10661499B2 · kind B2 · utility
0Cited by
74References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jan 28, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C64/393
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for printing a three-dimensional part with an additive manufacturing system, the method comprising generating and printing a planarizing part having a substantially-planar top surface relative to a build plane, and a bottom surface that substantially mirrors a topography of a platen surface, and printing the three-dimensional part over the substantially-planar top surface of the printed planarizing part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.