Methods and apparatus to couple a decorative layer to a panel via a high-bond adhesive layer
US10661530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2016 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatus to couple a decorative layer to a panel via a high-bond adhesive layer are disclosed. An example apparatus includes a panel, a high-bond adhesive layer fixed to the panel, a liner fixed to the high-bond adhesive layer that is fixed to the panel, and a first decorative layer removably coupled to the liner that is fixed to the high-bond adhesive layer via a second adhesive layer. The high-bond adhesive layer is to impede at least one of gas or vapor from escaping the panel to deter the at least one of gas or vapor from exerting a pressure on the first decorative layer to deter a portion of the first decorative layer from separating from the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.