Thermally conductive padding
US10661688B2 · kind B2 · utility
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12Claims
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Assignee
Inventor
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | May 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/029
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A thermally conductive padding 20 for transferring heat comprising a layer of cellular foam padding 10 having a plurality of spaced apart openings 22 formed therein. A thermal tunneling pad 24 is seated in each of the openings for creating a thermal path through the thermally conductive padding wherein the thermal tunneling pad includes a cellular foam block 12 encased in strip of thermally conductive graphite ribbon 26.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.