Adhesive patch and method of use in a packaging system
US10661955B2 · kind B2 · utility
0Cited by
33References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2016 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jan 16, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An adhesive patch and method of use thereof for forming a plurality of stackable items into a vertically stacked load are described. The method may include delivering an aligned stack of items positioned on a pallet for eventual transportation while minimizing the misalignment of the stackable items.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.