Method for self-aligning solder-attached mems die to a mounting surface
US10662057B2 · kind B2 · utility
0Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/055
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.