LED strips bussing system and process
US10663154B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2019 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Sep 13, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Bussing systems for bussing strips of LEDs that do not require insulation between adjacent copper solder pads, that enable cutting of each of the LED strips without loss of functionality for the cut strips(s), and that permit a power input lead to be soldered onto each strip without incident.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.