Optical assemblies including a spacer adhering directly to a substrate
US10663698B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Aug 25, 2016 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Aug 25, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.