Elongated lead frame and a method of manufacturing an elongated lead frame
US10665766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316′) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures. The second patterned layer comprising second structures for a second layer of the stack of the light emitter islands, the second patterned layer is provided on top of the first patterned layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.