Wireless module and method for manufacturing wireless module
US10665936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.