Semiconductor package
US10666249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Nov 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including a first master-slave status circuit configured to store one of a first signal or a second signal independently from a second master-slave status circuit, store the first signal in response to receiving a first initial signal from a first initialization circuit, the second master-slave status circuit configured to store one of the first signal or the second signal, store the first signal in response to receiving a second initial signal from a second initialization circuit, the first initialization circuit configured to provide the first initial signal to the first master-slave status circuit, the second initialization circuit configured to provide the second initial signal to the second master-slave status circuit, and a first master-slave determination circuit connected to the second master-slave status circuit, the first master-slave determination circuit configured to provide the second signal to the second master-slave status circuit may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.