Imaging chip packaging structure and camera device having the same
US10666843B2 · kind B2 · utility
2Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.