Accurate positioning and alignment of a component during processes such as reflow soldering
US10667387B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jul 12, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.