Stepped vias for next generation speeds
US10667393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Jan 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.