Embedded circuit board and method of making same
US10667402B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 28, 2018 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Sep 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0591
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.