Fully encapsulated electronics and printed circuit boards
US10667408B2 · kind B2 · utility
494Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2019 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.