Hybrid diamond-polymer thin film sensors and fabrication method
US10667709B2 · kind B2 · utility
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9References
24Claims
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Key dates
| Filing date | May 26, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.