Polymerizable compositions based on thermally cleavable compounds
US10667993B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 11, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jan 25, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/02
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The invention relates to a polymerizable composition which comprises a thermolabile polymerizable compound of Formula I: A-[X-(T-X-Sp-X)p-T-X-Q-(Z)n]m Formula I, wherein T represents a thermolabile Diels-Alder or hetero-Diels-Alder group of the Formula The invention also relates to the use of the polymerizable composition according to the present invention and the compounds of Formula I according to the present invention as polymerization resin or for the preparation of polymerization resins and polymerizates such as adhesives, composites, stereolithographic materials, shaped parts, duromers and mounting and fixing elements, and as dental material and for the preparation of dental materials such as adhesives, cements and filling composites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.