Resistive soldering method, assembly of antenna and glass, and resistive soldering system
US10668549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | May 4, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A resistive soldering method, assembly of antenna and glass, and resistive soldering system are provided. The method includes providing glass and an antenna component including a base structure and a cylindrical structure having a hole on a front surface of the base structure; forming solder on a surface to be soldered of the glass or a surface to be soldered of the base structure; resistive soldering the surfaces to be soldered of the glass and the base structure to melt the solder, wherein during the resistive soldering process, first and second electrodes are used to apply pressure and heating current to edge portion on the front surface of the base structure, and a support cylinder is inserted into the hole and applies to the antenna component a pressure for attaching the antenna component to the glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.