Device arrangement
US10669152B2 · kind B2 · utility
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1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jan 11, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Various embodiments may provide a device arrangement. The device arrangement may include a substrate including a conductive layer. The device arrangement may further include a microelectromechanical systems (MEMS) device monolithically integrated with the substrate, wherein the MEMS device may be electrically coupled to the conductive layer. A cavity may be defined through the conductive layer for acoustically isolating the MEMS device MEMS device from the substrate. At least one anchor structure may be defined by the conductive layer to support the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.