Latex composition for dip molding and molded article manufactured therefrom
US10669406B2 · kind B2 · utility
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3References
13Claims
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Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/0025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a latex composition for dip-molding and a dip-molded article produced therefrom. More specifically, by using a water-soluble polymer such as poly(N-isopropylacrylamide) or a copolymer thereof in combination with a carbonic acid-modified nitrile-based copolymer latex, the stability of the latex is improved through crosslinking by hydrogen bonding, it is possible to manufacture a molded article which has a slow syneresis and is excellent in workability and does not tear even at a thin thickness due to high tensile strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.