Patent · US Active

Silane endcapped polyamide resins

US10669448B2 · kind B2 · utility

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15Claims
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Assignee

Inventors

Key dates

Filing dateMay 5, 2017
Grant dateJun 2, 2020
Priority date
Expiry dateMay 5, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G77/455
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Disclosed herein are compounds having the formula: R1—(CO—NH—R2—R3)n and polymers made by moisture curing the compound. R1 is an organic group, a dimeric fatty acid chain, a dimeric linoleic fatty acid chain, a trimeric fatty acid chain, a saturated form of any thereof, a residue of a phenalkamine compound, or a residue of a polyamine. Each R2 is an aliphatic group or an aminoaliphatic group. Each R3 comprises an alkoxysilane group. The value n is a positive integer. The compound may be made by reacting a polyester with an amine having an alkoxysilane group or reacting a polyacid with an isocyanate having an alkoxysilane group. Also disclose are compounds made by reacting an amido amine with an epoxy compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.