Multi-layer deposition system and process

US10669627B2 · kind B2 · utility

Assignee

• HZO, Inc. · US

Inventors

• Yang Yun · Draper, US
• Max Sorenson · Cottonwood Heights, US
• Chien-Lan Hsueh · Campbell, US
• Tining Su · Draper, US
• Jim Dempster · Reno, US
• Alex Anderson · Rockford, US
• Layton Baker · Boulder, US

Key dates

• Filing date: Aug 30, 2017
• Grant date: Jun 2, 2020
• Expiry date: Aug 30, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/022
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.