Fabrication of a device on a carrier substrate
US10672608B2 · kind B2 · utility
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1References
17Claims
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Key dates
| Filing date | Jan 20, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Jan 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a device on a carrier substrate, and a device on a carrier substrate. The method comprises providing a first substrate; forming one or more device layers on the first substrate; bonding a second substrate to the device layers on a side thereof opposite to the first substrate; and removing the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.