Chip on film including signal lines for multiple signal paths and a display device having thereof
US10672698B2 · kind B2 · utility
0Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2018 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Dec 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip on film according to the present disclosure includes a base film, a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal in two signal paths, a driving unit on one surface of the upper surface and the lower surface of the base film, a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and a plurality of through holes between the first pad and the second pad and electrically connect to the signal wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.