Integrated circuit device
US10672890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2018 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Oct 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0188
Abstract
An integrated circuit device includes a substrate including a first device region and a second device region; a first fin separation insulating portion on the first device region; a pair of first fin-type active regions spaced from each other with the first fin separation insulating portion therebetween in the first device region and collinearly extending in a first horizontal direction; a second fin separation insulating portion extending in a second horizontal direction over the first device region and the second device region; and a pair of second fin-type active regions spaced from each other with the second fin separation insulating portion therebetween and collinearly extending in the first horizontal direction, wherein the first fin separation insulating portion and the second fin separation insulating portion vertically overlap each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.