Light emitting device package
US10672954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.