Multilayer rigid flexible printed circuit board and method for manufacturing the same
US10674610B1 · kind B1 · utility
0Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2020 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Feb 19, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.