Immersion cooling systems and methods
US10674641B2 · kind B2 · utility
13Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2016 |
| Grant date | Jun 2, 2020 |
| Priority date | — |
| Expiry date | Dec 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.