Method for laser cutting with optimized gas dynamics
US10675708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2017 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Feb 18, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This disclosure relates to methods for cutting metal workpieces in sheet form with a thickness of at least 2 mm. A laser beam is positioned in a nozzle opening of a cutting gas nozzle configured to cut via the laser beam and a cutting gas so that a beam axis of the laser beam along a direction of propagation of the laser beam is at least a distance of 3 mm from a rear opening wall portion of the nozzle opening. Cutting gas configured for concurrently exiting the nozzle opening with the laser beam is emitted through the nozzle opening at a cutting gas pressure (p) of at most 10 bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.