Systems and methods of flexible substrates for additive fabrication
US10675856B2 · kind B2 · utility
14Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Aug 25, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2309/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
According to some aspects, a method of additive fabrication is provided wherein a plurality of layers of material are formed on a build platform, the method comprising forming a layer of material in contact with a substrate and further in contact with either a previously formed layer of material or the build platform, the substrate being an actinically transparent, flexible, composite material, and subsequent to the forming of the layer of the material, actively separating the layer of material from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.