Method for manufacturing thermal print head
US10675888B1 · kind B1 · utility
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7Claims
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Assignee
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Key dates
| Filing date | Jan 10, 2019 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jan 10, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/22
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.