Heat conductive sheet
US10676587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2017 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.