Resin composition and article made therefrom
US10676590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2017 |
| Grant date | Jun 9, 2020 |
| Priority date | — |
| Expiry date | Nov 13, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/3595
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.