Chemical mechanical polishing slurry for cobalt applications

US10676646B2 · kind B2 · utility

Assignee

• Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

• Yannan Liang · Gilbert, US
• Liqing Wen · Mesa, US
• Bin Hu · Mesa, US
• Hyosang Lee · Seojong-myeon, KR
• Shu-Wei Chang · Hsinchu, TW
• Sung Tsai Lin · Taoyuan, TW

Key dates

• Filing date: May 21, 2018
• Grant date: Jun 9, 2020
• Expiry date: May 21, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A slurry that polishes surfaces or substrates which includes cobalt. The slurry further comprises an anionic and/or cationic surfactant, each of which has a phosphate group, a long chain alkyl group, or both. The slurry also includes a corrosion inhibitor, abrasives, removal rate enhancers, solvents, pH adjustors, and chelating agents. The pH of the slurry is preferably 8 or higher.